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Imide Derivatives | Valsynthese SA
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Imide Derivatives

N,N'-Bis(cyclohexyl)-1,2,4,5-cyclohexanetetracarboxylic-1:2,4:5-diimide

CAS N/A 

  • Formula: C22H30N2O4
  • Molecular weight: 386.48 g/mol
  • Packaging: tbd (production on demand)
  • Used as scaffold in biological active systems.
MSDS

N,N′-Bis(2-methylprop-2-en-1-yl)-1,2,4,5-cyclohexanetetracarboxylic-1:2,4:5-diimide

CAS N/A 

  • Formula: C18H22N2O4
  • Molecular weight: 330.38 g/mol
  • Packaging: tbd (production on demand)
  • Used in materials for high temperature applications, as ligands, radical crosslinker, and in polymeric resins.
MSDS

N,N'-Bis(4-hydroxyphenyl)-1,2,4,5-cyclohexanetetracarboxylic-1:2,4:5-diimide

CAS 2834753-14-7 

  • Formula: C22H18N2O6
  • Molecular weight: 406.39 g/mol
  • Packaging: tbd (production on demand)
  • Used in materials for high temperature applications, as ligand, crosslinker, and in polymeric resins as starting material for epoxy resins (higher solubility and thermal stability).
MSDS

N,N′-Bis(carboxymethyl)-bicyclo-octanetetracarboxylic-2:3,5:6-diimide

CAS N/A (new product)

  • Formula: C16H16N2O8
  • Molecular weight: 364.31 g/mol
  • Packaging: tbd (production on demand)
  • Application: Potential use in materials for high temperature applications, as ligand, crosslinker, and in polymeric resins.
MSDS

N,N'-Bis(2-hydroxyethyl)-bicyclo-octanetetracarboxylic-2:3,5:6-diimide

CAS N/A (new product)

  • Formula: C16H20N2O6
  • Molecular weight: 336.34 g/mol
  • Packaging: tbd (production on demand)
  • Application: Potential use in materials for high temperature applications, as ligand, crosslinker, and in polymeric resins as curing agent.
MSDS

N,N'-Bis(cyclohexyl)- bicyclo-octanetetracarboxylic-2:3,5:6-diimide

CAS N/A (new product)

  • Formula: C24H32N2O4
  • Molecular weight: 412.52 g/mol
  • Packaging: tbd (production on demand)
  • Application: Potential use as scaffold in biological active systems.
MSDS

N,N′-Bis(1-isopropyl-carboxymethyl)- bicyclooctanetetracarboxylic-2:3,5:6-diimide

CAS N/A (new product)

  • Formula: C22H28N2O8
  • Molecular weight: 448.47 g/mol
  • Packaging: tbd (production on demand)
  • Application: Potential use in materials for high temperature applications, as ligand, crosslinker, and in polymeric resins as starting material for protein crosslinking.
MSDS

N,N′-Bis(2-methylprop-2-en-1-yl)-bicyclo-octanetetracarboxylic-2:3,5:6-diimide

CAS N/A (new product)

  • Formula: C20H24N2O4
  • Molecular weight: 356.42
  • Packaging: tbd (production on demand)
  • Application: Potential use in materials for high temperature applications, as ligands, radical crosslinker and in polymeric resins.
MSDS

N,N'-Bis(4-hydroxyphenyl)-bicyclo-octanetetracarboxylic-2:3,5:6-diimide

CAS N/A (new product)

  • Formula: C24H20N2O6
  • Molecular weight: 432.42 g/mol
  • Packaging: tbd (production on demand)
  • Application: Potential use in materials for high temperature applications, as ligand, crosslinker, and in epoxy resins (higher solubility and thermal stability).
MSDS

N,N′-Bis(carboxymethyl)bicyclo[2.2.2]oct-7-ene-2,3,5,6-tetracarboxylic diimide

CAS 40366-40-3

  • Formula: C16H14N2O8
  • Molecular weight: 362.29 g/mol
  • Packaging: tbd (production on demand)
  • Application: Potential use in materials for high temperature applications, as ligand, crosslinker, and in polymeric resins.
MSDS

N,N'-Bis(2-hydroxyethyl)bicyclo[2.2.2]oct-7-ene-2,3,5,6-tetracarboxylic diimide

CAS 42038-96-0

  • Formula: C16H18N2O6
  • Molecular weight: 334.32 g/mol
  • Packaging: tbd (production on demand)
  • Application: Potential use in materials for high temperature applications, as ligand, crosslinker, and in polymeric resins as curing agent.
MSDS

N,N'-Bis(4-hydroxyphenyl)bicyclo[2,2,2]oct-7-ene-2,3,5,6-tetracarboxylic diimide

CAS 71669-19-7

  • Formula: C24H18N2O6
  • Molecular weight: 430.41 g/mol
  • Packaging: tbd (production on demand)
  • Application: Potential use in materials for high temperature applications, as ligand, crosslinker, and in polymeric resins as starting material for epoxy resins (higher solubility and thermal stability).
MSDS

N,N′-Bis(cyclohexyl)bicyclo[2.2.2]oct-7-ene-2,3,5,6-tetracarboxylic diimide

CAS 1164531-56-9

  • Formula: C24H30N2O4
  • Molecular weight: 410.51 g/mol
  • Packaging: tbd (production on demand)
  • Application: Potential use as scaffold in biological active systems.
MSDS

N,N′-Bis(2-methylprop-2-en-1-yl)bicyclo[2.2.2]oct-7-ene-2,3,5,6-tetracarboxylic diimide

CAS N/A

  • Formula: C20H22N2O4
  • Molecular weight: 354.40 g/mol
  • Packaging: tbd (production on demand)
  • Application: Potential use in materials for high temperature applications, as ligands, radical crosslinker and in polymeric resins.
MSDS

N,N′-Bis(1-isopropyl-carboxymethyl)-bicyclo[2.2.2]oct-7-ene-2,3,5,6-tetracarboxylic diimide

CAS 465534-72-9

  • Formula: C22H26N2O8
  • Molecular weight: 446.45 g/mol
  • Packaging: tbd (production on demand)
  • Application: Potential use in materials for high temperature applications, as ligand, crosslinker, and in polymeric resins as starting material for protein crosslinking.
MSDS

Bicyclo[2.2.2]oct-7-ene-2,3,5,6-tetracarboxylic 2,3:5,6-diimide

CAS 6787-63-9

  • Formula: C12H10N2O4
  • Molecular weight: 246.22 g/mol
  • Packaging: tbd (production on demand)
  • Application: Used in the production of polymers, for halogen-free flame-retardant resins, in materials for high temperature applications, and in pharmaceuticals.
MSDS

Bicyclo[2.2.2]octane-2,3,5,6-tetracarboxylic 2,3:5,6-diimide

CAS 1367346-83-5

  • Formula: C12H12N2O4
  • Molecular weight: 248.23 g/mol
  • Packaging: tbd (production on demand)
  • Application: Potential use in the production of polymers, in halogen-free flame-retardant resins, in materials for high temperature applications, and in pharmaceuticals as building-block.
MSDS

1,2,4,5-Cyclohexanetetracarboxylic 1,2:4.5-diimide

CAS 46688-10-2

  • Formula: C10H10N2O4
  • Molecular weight: 222.197 g/mol
  • Packaging: tbd (production on demand)
  • Application: Potential use in the production of polymers, in halogen-free flame-retardant resins, in materials for high temperature applications, electrochemical storage, and in pharmaceuticals as building-block.
MSDS

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