Imide Derivatives

N,N′-Bis(carboxymethyl)bicyclo[2.2.2]oct-7-ene-2,3,5,6-tetracarboxylic 2:3,5:6-diimide

CAS 357387-67-8

Formula: C₁₈H₁₈N₂O₈
Molecular weight: 390.34 g/mol
Packaging: tbd (production on demand)
Used as a specialty polymer monomer for high-temperature materials, as well as a crosslinking agent, polymer additive, and ligand.

N,N′-Bis(carboxymethyl)bicyclo[2.2.2]oct-7-ene-2,3,5,6,7-methyltetracarboxylic 2:3,5:6-diimide

CAS N/A

Formula: C₁₉H₂₀N₂O₈
Molecular weight: 404.37 g/mol
Packaging: tbd (production on demand)
Used as a specialty polymer monomer for high-temperature materials, as well as a crosslinking agent, polymer additive, and ligand.

N,N′-Bis(cyclohexyl)bicyclo[2.2.2]oct-7-ene-2,3,5,6,7-methyltetracarboxylic 2:3,5:6-diimide

CAS N/A

Formula: C₂₅H₃₂N₂O₄
Molecular weight: 424,53 g/mol
Packaging: tbd (production on demand)
Use as scaffold in biological active systems.

N-(2-Hydroxyethyl)-1,8-naphthalimide

CAS 5450-40-8

Formula: C₁₄H₁₁NO₃
Molecular weight: 241.24 g/mol
Packaging: tbd (production on demand)
Used as an intermediate for fluorescent dyes, optical and optoelectronic materials, fluorescent probes, and specialty naphthalimide derivatives.

1,8-Naphthalimide

CAS 81-83-4

Formula: C₁₂H₇NO₂
Molecular weight: 197.19 g/mol
Packaging: tbd (production on demand)
Used in the synthesis of fluorescent dyes, optical and optoelectronic materials, and specialty functional polymer derivatives.

N,N'-Bis(cyclohexyl)-1,2,4,5-cyclohexanetetracarboxylic-1:2,4:5-diimide

CAS N/A

Formula: C₂₂H₃₀N₂O₄
Molecular weight: 386.48 g/mol
Packaging: tbd (production on demand)
Used as scaffold in biological active systems.

N,N'-Bis(4-hydroxyphenyl)-1,2,4,5-cyclohexanetetracarboxylic-1:2,4:5-diimide

CAS 2834753-14-7

Formula: C₂₂H₁₈N₂O₆
Molecular weight: 406.39 g/mol
Packaging: tbd (production on demand)
Used in materials for high temperature applications, as ligand, crosslinker, and in polymeric resins as starting material for epoxy resins (higher solubility and thermal stability).

N,N′-Bis(carboxymethyl)-bicyclo-octanetetracarboxylic-2:3,5:6-diimide

CAS N/A (new product)

Formula: C₁₆H₁₆N₂O₈
Molecular weight: 364.31 g/mol
Packaging: tbd (production on demand)
Application: Potential use in materials for high temperature applications, as ligand, crosslinker, and in polymeric resins.

N,N'-Bis(2-hydroxyethyl)-bicyclo-octanetetracarboxylic-2:3,5:6-diimide

CAS N/A (new product)

Formula: C₁₆H₂₀N₂O₆
Molecular weight: 336.34 g/mol
Packaging: tbd (production on demand)
Application: Potential use in materials for high temperature applications, as ligand, crosslinker, and in polymeric resins as curing agent.

N,N'-Bis(cyclohexyl)- bicyclo-octanetetracarboxylic-2:3,5:6-diimide

CAS N/A (new product)

Formula: C₂₄H₃₂N₂O₄
Molecular weight: 412.52 g/mol
Packaging: tbd (production on demand)
Application: Potential use as scaffold in biological active systems.

N,N′-Bis(1-isopropyl-carboxymethyl)- bicyclooctanetetracarboxylic-2:3,5:6-diimide

CAS N/A (new product)

Formula: C₂₂H₂₈N₂O₈
Molecular weight: 448.47 g/mol
Packaging: tbd (production on demand)
Application: Potential use in materials for high temperature applications, as ligand, crosslinker, and in polymeric resins as starting material for protein crosslinking.

N,N'-Bis(4-hydroxyphenyl)-bicyclo-octanetetracarboxylic-2:3,5:6-diimide

CAS N/A (new product)

Formula: C₂₄H₂₀N₂O₆
Molecular weight: 432.42 g/mol
Packaging: tbd (production on demand)
Application: Potential use in materials for high temperature applications, as ligand, crosslinker, and in epoxy resins (higher solubility and thermal stability).

N,N′-Bis(carboxymethyl)bicyclo[2.2.2]oct-7-ene-2,3,5,6-tetracarboxylic diimide

CAS 40366-40-3

Formula: C₁₆H₁₄N₂O₈
Molecular weight: 362.29 g/mol
Packaging: tbd (production on demand)
Application: Potential use in materials for high temperature applications, as ligand, crosslinker, and in polymeric resins.

N,N'-Bis(2-hydroxyethyl)bicyclo[2.2.2]oct-7-ene-2,3,5,6-tetracarboxylic diimide

CAS 42038-96-0

Formula: C₁₆H₁₈N₂O₆
Molecular weight: 334.32 g/mol
Packaging: tbd (production on demand)
Application: Potential use in materials for high temperature applications, as ligand, crosslinker, and in polymeric resins as curing agent.

N,N'-Bis(4-hydroxyphenyl)bicyclo[2,2,2]oct-7-ene-2,3,5,6-tetracarboxylic diimide

CAS 71669-19-7

Formula: C₂₄H₁₈N₂O₆
Molecular weight: 430.41 g/mol
Packaging: tbd (production on demand)
Application: Potential use in materials for high temperature applications, as ligand, crosslinker, and in polymeric resins as starting material for epoxy resins (higher solubility and thermal stability).

N,N′-Bis(cyclohexyl)bicyclo[2.2.2]oct-7-ene-2,3,5,6-tetracarboxylic diimide

CAS 1164531-56-9

Formula: C₂₄H₃₀N₂O₄
Molecular weight: 410.51 g/mol
Packaging: tbd (production on demand)
Application: Potential use as scaffold in biological active systems.

N,N′-Bis(1-isopropyl-carboxymethyl)-bicyclo[2.2.2]oct-7-ene-2,3,5,6-tetracarboxylic diimide

CAS 465534-72-9

Formula: C₂₂H₂₆N₂O₈
Molecular weight: 446.45 g/mol
Packaging: tbd (production on demand)
Application: Potential use in materials for high temperature applications, as ligand, crosslinker, and in polymeric resins as starting material for protein crosslinking.

Bicyclo[2.2.2]oct-7-ene-2,3,5,6-tetracarboxylic 2,3:5,6-diimide

CAS 6787-63-9

Formula: C₁₂H₁₀N₂O₄
Molecular weight: 246.22 g/mol
Packaging: tbd (production on demand)
Application: Used in the production of polymers, for halogen-free flame-retardant resins, in materials for high temperature applications, and in pharmaceuticals.

Bicyclo[2.2.2]octane-2,3,5,6-tetracarboxylic 2,3:5,6-diimide

CAS 1367346-83-5

Formula: C₁₂H₁₂N₂O₄
Molecular weight: 248.23 g/mol
Packaging: tbd (production on demand)
Application: Potential use in the production of polymers, in halogen-free flame-retardant resins, in materials for high temperature applications, and in pharmaceuticals as building-block.

1,2,4,5-Cyclohexanetetracarboxylic 1,2:4.5-diimide

CAS 46688-10-2

Formula: C₁₀H₁₀N₂O₄
Molecular weight: 222.197 g/mol
Packaging: tbd (production on demand)
Application: Potential use in the production of polymers, in halogen-free flame-retardant resins, in materials for high temperature applications, electrochemical storage, and in pharmaceuticals as building-block.